24 results
Atomic Layer Deposited Hybrid Organic-Inorganic Aluminates as Potential Low-k Dielectric Materials
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- Journal:
- MRS Online Proceedings Library Archive / Volume 1791 / 2015
- Published online by Cambridge University Press:
- 25 May 2015, pp. 15-20
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- 2015
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Effects of process variables on properties and composition of a-Si:C:H films
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- Journal:
- Journal of Materials Research / Volume 18 / Issue 1 / January 2003
- Published online by Cambridge University Press:
- 31 January 2011, pp. 129-138
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- January 2003
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TiN prepared by plasma source ion implantation of nitrogen into Ti as a diffusion barrier for Si/Cu metallization
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- Journal of Materials Research / Volume 13 / Issue 3 / March 1998
- Published online by Cambridge University Press:
- 31 January 2011, pp. 726-730
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- March 1998
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Homogenization of the Bilayers of Cu-Al Alloy and Pure Copper to Produce CU-0.3 at.% Al Alloy Films
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- Journal:
- MRS Online Proceedings Library Archive / Volume 514 / 1998
- Published online by Cambridge University Press:
- 10 February 2011, 281
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- 1998
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Capacitance-Voltage, Current Voltage, and Thermal Stability of Copper Alloyed With Aluminum or Magnesium
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- Journal:
- MRS Online Proceedings Library Archive / Volume 514 / 1998
- Published online by Cambridge University Press:
- 10 February 2011, 263
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- 1998
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Dose-Dependent “Activation Energy” For Blistering Phenomenon In Hydrogen-Implanted Silicon
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- Journal:
- MRS Online Proceedings Library Archive / Volume 513 / 1998
- Published online by Cambridge University Press:
- 10 February 2011, 369
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- 1998
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Waveguide formation of KTiOPO4 by multienergy MeV He+ implantation
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- Journal:
- Journal of Materials Research / Volume 11 / Issue 6 / June 1996
- Published online by Cambridge University Press:
- 31 January 2011, pp. 1333-1335
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- June 1996
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Growth of CNxHy films by reactive magnetron sputtering of carbon in Ar/NH3 discharges
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- Journal:
- Journal of Materials Research / Volume 11 / Issue 4 / April 1996
- Published online by Cambridge University Press:
- 31 January 2011, pp. 981-988
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- April 1996
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Oxidation Resistant Dilute Copper (Boron) Alloy Films Prepared by DC-Magnetron Cosputtering
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- Journal:
- MRS Online Proceedings Library Archive / Volume 427 / 1996
- Published online by Cambridge University Press:
- 15 February 2011, 193
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- 1996
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Oxidation Resistant Dilute Copper (Boron) Alloy Films Prepared by DC-Magnetron Cosputtering
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- Journal:
- MRS Online Proceedings Library Archive / Volume 428 / 1996
- Published online by Cambridge University Press:
- 15 February 2011, 17
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- 1996
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Surface Passivation of Cu by Annealing Cu/Al Multilayer Films
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- Journal:
- MRS Online Proceedings Library Archive / Volume 391 / 1995
- Published online by Cambridge University Press:
- 15 February 2011, 321
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- 1995
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Surface and Interface Modification of Copper for Electronic Application
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- Journal:
- MRS Online Proceedings Library Archive / Volume 337 / 1994
- Published online by Cambridge University Press:
- 25 February 2011, 169
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- 1994
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Growth Kinetics and Materials Properties of Cu5Si
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- Journal:
- MRS Online Proceedings Library Archive / Volume 337 / 1994
- Published online by Cambridge University Press:
- 25 February 2011, 189
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- 1994
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Observation of Reduced Oxidation Rates for Plasmaassisted CVD Copper Films
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- Journal:
- MRS Online Proceedings Library Archive / Volume 309 / 1993
- Published online by Cambridge University Press:
- 21 February 2011, 455
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- 1993
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Interactions and Stability of Cu on CoSi2
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- Journal:
- MRS Online Proceedings Library Archive / Volume 260 / 1992
- Published online by Cambridge University Press:
- 25 February 2011, 151
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- 1992
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Ion Jimplantation to Inhibit Corrosion of Copper
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- Journal:
- MRS Online Proceedings Library Archive / Volume 265 / 1992
- Published online by Cambridge University Press:
- 15 February 2011, 199
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- 1992
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Stability of Sputter Deposited Al-Cu Bilayers on SiO2.
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- Journal:
- MRS Online Proceedings Library Archive / Volume 260 / 1992
- Published online by Cambridge University Press:
- 25 February 2011, 929
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- 1992
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Ion Implantation to Inhibit Corrosion of Copper
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- Journal:
- MRS Online Proceedings Library Archive / Volume 260 / 1992
- Published online by Cambridge University Press:
- 25 February 2011, 757
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- 1992
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The Effect of Grain Boundaries and Substrate Interactions with Hydrogen on the CVD Growth of Device-Quality Copper.
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- MRS Online Proceedings Library Archive / Volume 229 / 1991
- Published online by Cambridge University Press:
- 15 February 2011, 123
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- 1991
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Structure of Au-Al2O3 Granular Metal Films
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- Journal:
- MRS Online Proceedings Library Archive / Volume 237 / 1991
- Published online by Cambridge University Press:
- 21 February 2011, 171
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- 1991
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